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| CPxxTD1-12A/CPxxTD1-24A |
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| Transfer mold CIB modules with low loss CSTBTTM |
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Outline |
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Since the development of our converter inverter brake (CIB) modules for small inverters with up to 3.7 kW drives in 1994, our CIB modules have been widely used for their low loss characteristics and superior reliability. Meeting market needs for a more compact, lower loss and lower cost modules, we have launched the DIP-CIB Series. It employs a CSTBTTM chip, a high heat releasing insulation structure and a transfer mold technique to achieve a more compact, lightweight package boasting low loss characteristics as well as high reliability. |
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Features |
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The transfer mold structure cuts the footprint by 50%, compared with our other existing models, and paves the way to smaller lighter weight equipment. |
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Fitted with the optimized CSTBTTM, the DIP-CIB Series has a 25% lower power loss when compared with our other existing models. This contributes to low power loss and higher power conversion efficiency in application equipment. |
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Fitted with our new insulation sheet, boasting a high heat releasing property, thermal resistance has been reduced by more than 20% compared with our equal capacity DIP-IPM. |
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A lead-free solder is used to make the product RoHS compliant. |
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Main Specifications |
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Voltage between the collector and the emitter: (VCES): 600V/1,200V |
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Collector Current (Ic): 20A, 30A/600V; 10A, 15A, 20A/1200V |
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Dielectric Strength Voltage (Viso): 2,500Vrms |
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Bonding Temperature (Tj): From -20 to 150oC |
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Preservation Temperature (Tstg): From -40 to 125oC |
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Applications |
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Small general purpose inverters, AC servo systems and industrial motor drives. |
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Future Deployment |
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We will enhance the performance of the built-in power chip (lower loss, higher current density) and optimize the package structure in order to achieve further miniaturization and higher module current capacity. |
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