Power Modules MOS: Index page
Enter Device Number
Use * for partial, i.e.: m66*
Download Adobe Acrobat Reader
Please contact your local Sales Office
for product availability in your region.
Mitsubishi Power Devices
Power Modules MOS
FEATURED PRODUCTS:
View Index
size 48K
1.0 INTRODUCTION
View
Index
size 137K
2.0 MAIN APPLICATIONS FOR POWER MODULES
View Index
size 82K
3.0 GENERAL CONSIDERATIONS FOR IGBT AND INTELLIGENT POWER
MODULES
View Index
size 381K
4.0 USING IGBT MODULES
View
Index
size 330K
5.0 USING HYBRID GATE DRIVERS
View Index
size 112K
6.0 INTRODUCTION TO INTELLIGENT POWER MODULES (IPM)
View Index
size 978K
FEATURED PRODUCTS:
Technology and Trend IGBT, Third Generation H-Series IPM1.0 INTRODUCTION
2.0 MAIN APPLICATIONS FOR POWER MODULES
2.1 Basic Circuit Examples of Main Power Module
Applications
2.2 Applications of IPM/IGBT Module to AC Motor Controls
(VVVF Inverter, Servo Amps, etc.)
3.0 GENERAL
CONSIDERATIONS FOR IGBT AND INTELLIGENT POWER MODULES
3.1 Numbering System
3.2 Power Circuit Design
3.2.1 Turn-off Surge Voltage
3.2.2 Free-Wheel Diode Recovery Surge
3.2.3 Ground Loops
3.2.4 Reducing Power Circuit Inductance
3.3 Snubber Design
3.3.1 Snubber Types
3.3.2 Effect of Snubber Inductance
3.3.3 Effect of Bus Inductance
3.3.4 Power Circuit and Snubber Recommendations
3.4 Thermal Considerations
3.4.1 Estimating Power Losses
3.4.2 VVVF Inverter Loss Calculation
3.4.3 Loss Estimation by Calibrated Heat Sink
Method
3.4.4 Estimating Average Junction Temperature
3.4.5 Estimating Junction Temperature Rise
3.4.6 Heatsink Mounting
3.4.7 Power Cycling Considerations
3.5 Reliability
3.5.1 Test Results
4.0 USING
IGBT MODULES
4.1 Structure and Operation of IGBT Module
4.1.1 Silicon Structure
4.1.2 Device Operation
4.1.3 Wafer Processing
4.1.4 Module Packaging Construction and Layout
4.1.5 Features of U-Series IGBT Packages
4.2 IGBT Module
Ratings and Characteristics
4.2.1 Absolute Maximum Ratings
4.2.2 Electrical Characteristics
4.2.3 Thermal Characteristics
4.2.4 Test Circuits and Conditions
4.3 Safe Operation Area
4.3.1 Turn-off Switching SOA of IGBT
4.3.2 Short Circuit SOA
4.4 Performance Curves
4.4.1 Output Characteristics
4.4.2 Collector-Emitter Saturation Voltage
4.4.3 Device Capacitance
4.4.4 Gate Charge
4.4.5 Switching Characteristics
4.4.6 FWDi Characteristics
4.4.7 Transient Thermal Impedance
4.4.8 Switching Energy Characteristics
4.5 IGBT Selection
4.6 IGBT Module Gate Drive
4.6.1 Gate Drive Voltage
4.6.2 RG Series Gate
Resistance
4.6.3 Gate Drive Power Requirements
4.6.4 Gate Drive Layout Considerations
4.7 Protecting IGBT Modules
4.7.1 dv/dt Protection
4.7.2 Short Circuit Protection
4.7.3 Handling Precautions
4.8 Parallel
Operation
4.8.1 Static Current Balance
4.8.2 Dynamic Current Balance
5.0
USING HYBRID GATE DRIVERS
5.1 Output Current Limit
5.2 Power Supply Requirements
5.2.1 Supply Current
5.2.2 Single Supply Operation
5.3 Total Power
Dissipation
5.4 Application Circuit for M57957L and M57958L
5.5 Short-Circuit Protection Using Desaturation Techniques
5.6 Operation ofM57959L and M57962L
5.7 Application Circuit for M57959L and M57962L
5.8 Adjusting the Desaturation Trip Time (tTRIP)
5.9 Operational Waveforms
5.10 Driving Large IGBT Modules
6.0 INTRODUCTION TO INTELLIGENT
POWER MODULES (IPM)
6.01 Third Generation Intelligent Power Modules
6.02 V-Series High Power IPMs
6.1 Structure of
Intelligent Power Modules
6.1.1 Multilayer Epoxy Construction
6.1.2 Ceramic Isolation Construction
6.1.3 V-Series IPM Construction
6.1.4 Advantages of Intelligent Power Module
6.2 IPM Ratings and
Characteristics
6.2.1 Maximum Ratings
6.2.2 Thermal Resistance
6.2.3 Electrical Characteristics
6.2.4 Recommended Operation Conditions
6.2.5 Test circuits and Conditions
6.3 Area of Safe Operation for Intelligent Power Modules
6.3.1 Switching SOA
6.3.2 Short Circuit SOA
6.3.3 Active Region SOA
6.4 IPM Self
Protection
6.4.1 Self Protection Features
6.4.2 Control Supply Under-Voltage Lock-Out
6.4.3 Over-Temperature Protection
6.4.4 Over-Current Protection
6.4.5 Short Circuit Protection
6.5 IPM Selection
6.5.1 Coordination of OC Trip
6.5.2 Estimation Losses
6.6 Controlling the
Intelligent Power Module
6.6.1 The Control Power Supply
6.6.2 Interface Circuit Requirements
6.6.3 Example Interface Circuits
6.6.4 Connecting the Interface Circuit
6.6.5 Dead Time (tdead)
6.6.6 Using the Fault Signal
6.7 IPM Inverter
Example
6.8 Handling Precautions for Intelligent Power Modules
Product Info
| Data Sheets | Technical Info | Company | Contacts and Support
Factories/R&D | Careers | Press
Room | Events | Home
Copyright © 1997-99 Mitsubishi Electronics America, Inc.
Legal
Send feedback to Webmaster