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MELBUS-L
Miniaturized and thin
Compatible with narrow-pitch flip-chip mounting
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Outline
Demand is rapidly growing for buildup boards that can carry several or dozens of semiconductor s and LCRs for modules. Recently, in particular, the actual examination of 60~80-µm- levelnarrow-pitch flip-chip mounting has begun, and demand is rising for these highly minute boards as substrates and interposers for modules .
Features
Compatible with bare-chip mounting
It has high rigidity, and for a thin board does not twist or bend. Moreover, since it adopts the all-glass-layer, epoxy-type buildup board which has excellent coplanarity, it has good flip-chip and wire-bonding bare-chip mounting characteristics.
Module miniaturization possible
Module miniaturization is realized by the adoption of the semi-additive process for copper seed layers and Via technology that enables a wiring width/interval =25/25µm and Via/land diameter =ø80 /150µm
Applications
Ideal as a module for data communications terminals, wireless LAN, Bluetooth, CCD cameras, TFT, digital appliances, etc.
Future deployment
As a next-generation mounting technology, the module board substrate is due to be produced commercially for substrates with built-in passive parts or added passive element functions, such as capacitors and inductors.
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