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FM200/400/600TU -07A/-2A/-3A
Low-loss trench MOSFET module contributes to the miniaturization of large controllers for low-voltage power sources
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Outline
Demand is rapidly growing for buildup boards that can carry several or dozens of semiconductor s and LCRs for modules. Recently, in particular, the actual examination of 60~80-µm- levelnarrow-pitch flip-chip mounting has begun, and demand is rising for these highly minute boards as substrates and interposers for modules .
Features
New development package makes module's external design easy to miniaturize
The P and N terminals and output terminals are arranged opposite each other on the package, enabling easier external wiring.
The connector to the gate source sense terminal is adopted and assembled, making it easier to exchange.
6-element (3-phase inverter bridge circuit) miniature package
Compared with using 3 of the company's previous low-voltage IGBT modules (2 terminal), only about 1/3rd the module installation space is required. The large decrease in required installation space makes a major contribution to device miniaturization.
Adopts trench-gate MOSFET chip
The latest trench-gate structure MOSFET chip is adopted, enabling low-loss devices
1 element 1 chip enabled; avalanche voltage strengthened
With previous discrete-type MOSFETs in multiple connection, the amount of avalanche voltage was kept low. This time, 1 element 1 chip is realized, making the snubber circuit obsolete, and strengthening the amount of avalanche voltage.
Dedicated temperature detection terminal
The module's built-in thermistor can be connected to a special monitor to detect a rise in temperature easily and improve device reliability.
Applications
Battery forklift, UPS
Future deployment
From now on, it will expand to cover industrial machinery controllers, especially those driving low- voltage power sources such as batteries.
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