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BA01232
BA01232
Successfully miniaturized to 0.02cc, while realizing top-level efficiency 50% and low idle current 35mA.
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Outline
Because of the miniaturization and weight reduction of W-CDMA system mobile phone terminals, along with the miniaturization of parts, it is necessary to increase the efficiency and miniaturization of the transmission power amplifier which consumes most of the current at the time of actuation. Furthermore, in the W-CDMA system, there are many cases when it uses small output power, so the reduced idle current (current without high frequency signaling) becomes important. In our company, due to the module matching circuit and optimized transistor structure, top-level power efficiency 50% and low idle current 35m A are realized. We have succeeded in producing a micro transmission power amplifier module miniaturized in 0.02cc.
Features
Realizes industry top-level power efficiency 50% to improve call time with mobile phone terminals
After optimizing module circuitry and the structure and size of transistors, top-level power efficiency 50% and low idle current of 35mA were realized.
Resin sealed package structure allows more compact, low-profile design and further mobile phone miniaturization
The conventional metal cap is replaced by a resin seal, the built-in chips are miniaturized and circuit layout optimized, to enable the inclusion of a GaAs HBT amplifier (2-step configuration) and matching circuit to decrease distortion within a capacity of 0.02cc (4x4x1.2mm).
Applications
Ideal as a transmission power amplifier for W-CDMA system mobile phone terminal.
Future deployment
In future, we aim to continue miniaturization with the MMIC (Microwave Monolithic IC), and improve compatibility with more efficient, high-speed communication systems.
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