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BA01241
Achieved volume of 0.01cc (3 x 3 x 1mm3), the smallest size in the class in the industry by utilizing GaAs HBT MMIC
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Outline
Since the modulation method of cellular phone service and allocated frequency differ by countries and carriers, cellular phone handsets are equipped with power amplifiers meeting the modulation method and the frequency of each service. Multi-band cellular phone handsets intended for use in multiple services require being equipped with multiple power amplifiers, and miniaturization of power amplifiers is desired. We have developed power amplifiers compatible with the United States 800 MHz band N-CDMA method, achieving the smallest size in the industry.
Features
By achieving the smallest size in the industry, miniaturizing multi-band cellular phone handset, making full use of MMIC engineering technology and changing a portion of the chip parts to MMIC, we have reduced the number of chip parts and created the smallest size in the industry with a packaging area of 3mm x 3mm, which is approximately half the existing product.
By resining the matching circuit board, it became possible to configure the multi-band cellular phone handsets by a resin board with a substrate structure which is slimmer and lighter with reduced heat resistance, and we have created a slimmer and lighter product that is 1.0 mm in height and 0.02g in mass.
Applications
Perfect for power amplifiers for multi-band cellular phone handset compatible with the United States 800 MHz band N-CDMA method.
Future Deployment
In the future, we plan to improve the operation efficiency further and expand and develop power amplifiers compatible with the W-CDMA modulation method and other frequency bands.
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