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PS22052/PS22053/PS22054/PS22056
The first in industry 1200V pressure proof transfer mold type DIP-IPM
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Outline
While inverters are becoming rapidly popular in both industrial and commercial fields based on the needs for energy saving and miniaturization, the 600V pressure resistant DIP-IPM Series is being adopted by many clients. However, for the 1200V pressure resistant Intelligent Power Module (IPM) available for AC400V system, which is the main power current overseas, there have only been large suitcase types in the past, and there has been demand for smaller and lower loss products. In order to meet this demand, we have developed the first 1200V pressure resistant transfer mold type DIP-IPM in the industry to achieve smaller and lower loss by attempting high integration of HVIC utilizing the optimal design of IGBT and cutting edge HVIC design and production technology.
Features
By adopting the new optimally designed 1μm Planer Type IGBT, power loss is reduced by approximately 30% compared to our existing product, contributing to miniaturization of the heat radiation system of the equipment.
Further integration was achieved by installing the cutting edge 1200V HVIC Process (5μm) IC. We produced a compact outer shape with a package area of approximately 42% of our existing product and, furthermore, with improved prevention of malfunctions caused by noise, we have achieved high reliability as well.
It complies with RoHS Regulations in the lead-free solder plating of the outside terminal. (Sn-Cu system)
Applications
Perfect for driving inverters of industrial air conditioners and for driving small capacity industrial AC400V system power motors, such as multipurpose inverters and servos.
Main Specifications

Output element pressure resistance 1200V

  Outside dimension 79 x 44 x 8.2 (mm)
  Collector current 5, 10, 15, 25 A
  Three-phase inverter composition (GBT x 6, FWD x 6)
  Built-in driving circuits (HVIC, LVIC)
Built-in various protective circuits (short-circuit protection, power source voltage reduction protection)
Future Deployment
Planning to attempt lower heat and lower resistance by newly developing packages adopting a discontinuous structure equivalent to the 600V series ultra-compact DIP-IPM Ver.4, which has achieved lower heat and lower resistance.
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