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CPxxTD1-12A/CPxxTD1-24A
Transfer mold CIB modules with low loss CSTBTTM
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Outline
Since the development of our converter inverter brake (CIB) modules for small inverters with up to 3.7 kW drives, our CIB modules have been widely used for their low loss characteristics and superior reliability. Meeting market needs for a more compact, lower loss and lower cost modules, we have launched the DIP-CIB Series. It employs a CSTBTTM chip, a high heat releasing insulation structure and a transfer mold technique to achieve a more compact, lightweight package boasting low loss characteristics as well as high reliability.
Features
The transfer mold structure cuts the footprint by 50%, compared with our other existing models, and paves the way to smaller lighter weight equipment.
Fitted with the optimized CSTBTTM, the DIP-CIB Series has a 25% lower power loss when compared with our other existing models. This contributes to low power loss and higher power conversion efficiency in application equipment.
Fitted with our new insulation sheet, boasting a high heat releasing property, thermal resistance has been reduced by more than 20% compared with our equal capacity DIP-IPM.
A lead-free solder is used to make the product RoHS compliant.
Main Specifications
Voltage between the collector and the emitter: (VCES): 600V/1,200V
Collector Current (Ic): 20A, 30A/600V; 10A, 15A, 20A/1200V
Dielectric Strength Voltage (Viso): 2,500Vrms
Bonding Temperature (Tj): From -20 to 150oC
Preservation Temperature (Tstg): From -40 to 125oC
Applications
Small general purpose inverters, AC servo systems and industrial motor drives.
Future Deployment
We will enhance the performance of the built-in power chip (lower loss, higher current density) and optimize the package structure in order to achieve further miniaturization and higher module current capacity.
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